Asia-Pacific Semiconductor Packaging and Assembly (P&A) Equipment Market: Insights and Forecast 2018-2025

Asia-Pacific Semiconductor Packaging and Assembly (P&A) Equipment Market: Insights and Forecast 2018-2025

Emphasis on Process Type (Plating, Inspection and Dicing, Wire Bonding, Die-Bonding, Others (Including Packaging)), Application (Consumer Electronics, Communication, Automotive, Industrial, Other) and Country

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Published: Mar-2019

Pages:110

Table:63

Figure:58

Report ID:UMSE19146

The Asia-Pacific Semiconductor packaging and assemble equipment market is anticipated to grow at a CAGR of 5.6% during the analysed period 2019-2025. Increase use of semiconductor chip in daily used equipment’s are the major factor driving the market. Semiconductors form the foundation of all the electronics that we use in our daily lives. From alarm clock to microwave to the cell phone and laptop that enable our workday, most of the things in our surrounding are powered by semiconductor chips. The Asia Pacific is the biggest semiconductor industry across the globe and it is growing rapidly owing to the high penetration of integrated semiconductor chips across all the industry verticals. The increasing usage of semiconductor integrated chip across several industry segments like mobile and consumer electronic devices, automobiles, medical equipment, high definition television, and laptops has increased the requirement of packaging and assembly equipment. The presence of many major players in the Asian region further boosts the market. The Internet of Things and automation in automobiles have boosted the semiconductor market which in return propels the packaging and assembling equipment industry in Asian countries. The usage of semiconductor ICs for automated driving, automatic braking system, GPS, power doors and windows bring high potential in the market. However, the requirement of heavy investments, trade war and fluctuating foreign exchange rates are hampering the market. Inspite of this, the favourable government policies and increasing usage of automation in countries such as China and Taiwan are anticipated to be a key opportunity areas for the players in the industry.

APAC Semiconductor P&A Equipment Market size by Process, 2018-25 (US$ million)

“Owing to the increase in demand of advanced electronics due to growing electrification and automation of automobiles, automotive application segment is anticipated to show a remarkable CAGR during the forecast period”

The semiconductor packaging and assembly equipment market is segmented on the basis of process type and application areas. There are a number of packaging and assembly equipment processes adopted in the industry, such as plating, inspection and dicing, wire bonding, die-bonding, and others. The Die bonding held the major share in 2018. On the other hand, plating process is anticipated to be the fastest growing segment during the forecast period (2019-2025). On the basis of application, the market is bifurcated into consumer electronics, communication, automotive, industrial and others. In 2018, communications held the major share of the Asian semiconductor packaging and assembly equipment market. However, owing to the increase in demand of advanced electronics due to growing electrification and automation of automobiles, automotive application segment is anticipated to show a remarkable CAGR during the forecast period.

“The governmental funds and policies such as the National Fund and local Integrated Circuits (IC) funds, created in 2014, and the Made in China 2025 policy are some of the major reasons fuelling the demand within China”

Further, semiconductor packaging and assembly market report is bifurcated across several countries. This includes China, Japan, India, South Korea, Singapore, Taiwan and the rest of APAC. Taiwan dominated the market in 2018 and is expected to maintain its dominance while, China is expected to showcase a notable CAGR during the forecast period. The governmental funds and policies such as the National Fund and local Integrated Circuits (IC) funds, created in 2014, and the Made in China 2025 policy are some of the major reasons fuelling the demand within China.

Competitive Landscape-Top 10 Market Players


Some of the key players in the market include Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics, Jiangsu Changjiang Electronics Technology Co., Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group. These players are adopting several market strategies, such as merger & acquisition, business expansion and collaboration, among others to strengthen their foothold in the industry.

Reasons to buy this report:


  • Historical and forecast market size validated through primary and secondary sources
  • In depth analysis of prominent industry peers with primary focus on key business financials, product portfolio, expansion strategies, SWOT analysis and recent developments
  • Examination on drivers, restraints, key trends and opportunities prevailing in the industry.
  • Examination of industry attractiveness  with the help of Porter’s Five Forces analysis
  • Comprehensive coverage of the market across different market segments
  • Deep dive country level analysis of the industry

Customization Options:


The Asia-Pacific semiconductor packaging and assembly market report can be customized, focusing a specific country or any other market segment. Besides this, UMI understands that you may have your own business need, please connect with our analyst, who will ensure you get a report that suits your needs.

             
  1 MARKET INTRODUCTION
    1.1 Market Definition
    1.2 Objective of the Study
    1.3 Limitation    
    1.4 Stakeholders  
    1.5 Currency used in the Report
  2 RESEARCH METHODOLOGY
    2.1 Research Methodology for Asia-Pacific Semiconductor P&A Equipment Market
      2.1.1 Main objective of the Asia-Pacific Semiconductor P&A Equipment Market Study
  3 INDUSTRY PERFORMANCE
  4 EXECUTIVE SUMMARY  
  5 MARKET OVERVIEW  
    5.1 Introduction  
    5.2 Market Dynamics
      5.2.1 Market Trend & Drivers
        5.2.1.1 Increase in Sales of Smart Phones and Other Smart Consumer Electronic Devices
        5.2.1.2 Improved Medical Applications and Equipment
        5.2.1.3 Growing Scope in the Internet of Things
        5.2.1.4 Increase in Vehicle Automation
      5.2.2 Market Restraints
        5.2.2.1 The requirement of High Investment
      5.2.3 Market Opportunities
        5.2.3.1 Rise in Use of 3D Packaging technology
        5.2.3.2 Development of new Assembly Process
    5.3 Key Market Indicators
      5.3.1 Demand and Supply Side Analysis
        5.3.1.1 Top Winning Strategies
          5.3.1.1.1 Top Product launches
          5.3.1.1.2 Business Expansions
          5.3.1.1.3 Top Acquisition, Partnerships, Collaborations
      5.3.2 Value Chain Analysis
  6 MARKET INSIGHTS by PROCESS TYPE
    6.1 General Overview
      6.2 Plating  
      6.3 Inspection and Dicing
      6.4 Wire Bonding
      6.5 Die-Bonding
      6.6 Others (Including Packaging)
  7 MARKET INSIGHTS BY APPLICATION
    7.1 General Overview
      7.2 Consumer Electronics
      7.3 Communication
      7.4 Automotive
      7.5 Industrial  
      7.6 Other Industry
  8 MARKET INSIGHTS BY COUNTRY
    8.1 General Overview
      8.1.1 APAC Semiconductor P&A Equipment Market by Country, 2018-25
        8.1.1.1 China Semiconductor P&A Equipment Market
          8.1.1.1.1 Chinese Export Import data of Semiconductor Devices (2012-2018)
          8.1.1.1.2 China Semiconductor P&A Equipment Market Size, 2018-25
        8.1.1.2 Japan Semiconductor P&A Equipment Market
          8.1.1.2.1 Production Value of Japanese Electronic Industry (2012-2017)
          8.1.1.2.2 Japan Export Import data of Semiconductor Devices (2012-2018)
          8.1.1.2.3 Japan Semiconductor P&A Equipment Market Size, 2018-25
        8.1.1.3 India Semiconductor P&A Equipment Market
          8.1.1.3.1 Key notable developments in Semiconductor & Electronic Sector
          8.1.1.3.2 Key Government Initiative for Semiconductor & Electronic Sector
          8.1.1.3.3 India Export Import data of Semiconductor Devices (2012-2018)
          8.1.1.3.4 India Semiconductor P&A Equipment Market Size, 2018-25
        8.1.1.4 Singapore Semiconductor P&A Equipment Market
          8.1.1.4.1 Singapore Export Import data of Semiconductor Devices (2012-2018)
          8.1.1.4.2 Singapore Semiconductors Market size and Local Production (2015-18)
          8.1.1.4.3 Singapore Semiconductor P&A Equipment Market Size, 2018-25
        8.1.1.5 South Korea Semiconductor P&A Equipment Market
          8.1.1.5.1 South Korea Export Import data of Semiconductor Devices (2012-2018)
          8.1.1.5.2 South Korea Semiconductor P&A Equipment Market Size, 2018-25
        8.1.1.6 Taiwan Semiconductor P&A Equipment Market
          8.1.1.6.1 Taiwan Semiconductor Equipment Market & Local Production (2015-18)
          8.1.1.6.2 Taiwan Export Import data of Semiconductor Devices (2011-2017)
          8.1.1.6.3 Taiwan Semiconductor P&A Equipment Market Size, 2018-25
        8.1.1.7 Rest of APAC Semiconductor P&A Equipment Market
          8.1.1.7.1 Malaysia Semiconductor Production, 2013-2017 (US$ billion)
          8.1.1.7.2 Malaysia Export Import data of Semiconductor Devices (2012-2018)
          8.1.1.7.3 Rest of APAC Semiconductor P&A Equipment Market Size, 2018-25
  9 COMPETITIVE SCENARIO
    9.1 Porter’s Five Forces Analysis
      9.1.1 Bargaining power of Buyer
      9.1.2 Bargaining power of Supplier
      9.1.3 Threat of new entrants
      9.1.4 Availability of Substitute
      9.1.5 Industry Rivalry
    9.2 APAC Semiconductor P&A Equipment Market Share Analysis, 2018
  10 TOP COMPANY PROFILES
    10.1 Amkor Technology Inc.
      10.1.1 Key Facts  
      10.1.2 Business Description
      10.1.3 Key Product/Services Offerings
      10.1.4 SWOT Analysis
      10.1.5 Key Financials
        10.1.5.1 Revenue Split
      10.1.6 Recent Developments
    10.2 Fujitsu Ltd.  
      10.2.1 Key Facts  
      10.2.2 Business Description
      10.2.3 Key Product/Services Offerings
      10.2.4 SWOT Analysis
      10.2.5 Key Financials
        10.2.5.1 Revenue Split
      10.2.6 Recent Developments
    10.3 Toshiba Corporation
      10.3.1 Key Facts  
      10.3.2 Business Description
      10.3.3 Key Product/Services Offerings
      10.3.4 SWOT Analysis
      10.3.5 Key Financials
        10.3.5.1 Revenue Split
      10.3.6 Recent Developments
    10.4 Qualcomm Incorporated
      10.4.1 Key Facts  
      10.4.2 Business Description
      10.4.3 Key Product/Services Offerings
      10.4.4 SWOT Analysis
      10.4.5 Key Financials
        10.4.5.1 Revenue Split
      10.4.6 Recent Developments
    10.5 Renesas Electronics Corporation
      10.5.1 Key Facts  
      10.5.2 Business Description
      10.5.3 Key Product/Services Offerings
      10.5.4 Growth Strategy
      10.5.5 SWOT Analysis
      10.5.6 Key Financials
        10.5.6.1 Revenue Split
      10.5.7 Recent Developments
    10.6 Samsung Electronics Co. Ltd.
      10.6.1 Key Facts  
      10.6.2 Business Description
      10.6.3 Key Product/Services Offerings
      10.6.4 SWOT Analysis
      10.6.5 Key Financials
        10.6.5.1 Revenue Split
      10.6.6 Recent Developments
    10.7 Jiangsu Changjiang Electronics Technology Co., Ltd.
      10.7.1 Key Facts  
      10.7.7 Business Description
      10.7.3 Key Product/Services Offerings
      10.7.4 SWOT Analysis
      10.7.5 Key Financials
        10.7.5.1 Revenue Split
      10.7.6 Recent developments
    10.8 ChipMOS Technologies Inc.
      10.8.1 Key Facts  
      10.8.2 Business Description
      10.8.8 Key Product/Services Offerings
      10.8.4 Growth Strategy
      10.8.5 SWOT Analysis
      10.8.6 Key Financials
        10.8.6.1 Revenue Split
      10.8.7 Recent developments
    10.9 Powertech Technology Inc.
      10.9.1 Key Facts  
      10.9.2 Business Description
      10.9.3 Key Product/Services Offerings
      10.9.9 Growth Strategy
      10.9.5 SWOT Analysis
      10.9.6 Key Financials
        10.9.6.1 Revenue Split
      10.9.7 Recent developments
    10.10 ASE Group    
      10.10.1 Key Facts  
      10.10.2 Business Description
      10.10.3 Key Product/Services Offerings
      10.10.4 Growth Strategy
      10.10.5 SWOT Analysis
      10.10.6 Key Financials
        10.10.6.1 Revenue Split
      10.10.7 Recent developments

Research Methodology for Asia Pacific Semiconductor P&A Equipment Market

Analysing historical market, estimation of the current market and forecasting the future market for packaging and assembly equipment were the three major steps to analyse the overall adoption rate in Asia Pacific market. Exhaustive secondary research was done to collect the historical market of the industry and overall estimation of the current market. Secondly, to validate these insights, numerous findings and assumptions were taken into consideration. Moreover, exhaustive primary interviews were conducted with industry experts across the value chain of the Asia Pacific packaging and assembly equipment industry. After all the assumption, market engineering and validation of market numbers through primary interviews, top-down approach was employed to forecast the complete market size of packaging and assembly equipment market at regional scale. Thereafter, market breakdown and data triangulation methods were adopted to estimate and analyse the market size of segments and sub-segments of the market. Detailed research methodology is explained below:

Analysis of Historical Market size

Step 1: In-Depth Study of Secondary Sources:


Detailed secondary study was conducted to obtain the historical market size of the Asia Pacific packaging and assembly equipment market through company internal sources such as annual report & financial statements of top players, performance presentations, press releases, inventory records, sales figures etc. and external sources including trade journals, news & articles, government publications, economic data, competitor publications, sector reports, regulatory bodies publications, safety standard organizations, third-party database and other credible sources/publications.

Step 2: Market Segmentation:


After obtaining historical market size of the overall market, detailed secondary analysis was conducted to gather historical market insights and share for different segments & sub-segments for the packaging and assembly equipment. The major segments included in the report are process types and applications.

Step 3: Factor Analysis:


After acquiring the historical market size of different segments and sub-segments, detailed factor analysis was conducted to estimate the current market size of the packaging and assembly equipment. The factor analysis was conducted using dependent and independent variable such as purchasing power of consumers, government initiatives, and penetration of advanced electronics across several industries, among others. The historical trends of the packaging and assembly equipment and their year-on-year impact on the market size and share in the recent past were analyzed. The demand and supply side scenario was also thoroughly studied.

Current Market size Estimate & Forecast

Current Market Sizing: Based on actionable insights from the above 3 steps, we arrived at current market size, key players in market, market share of these players, industry’s supply chain, and value chain of the industry. All the required percentage shares, splits, and market breakdowns were determined using the above mentioned secondary approach and were verified through primary interviews.

Estimation & Forecasting: For market estimation and forecast, weightage was assigned to different factors including market dynamics such as drivers & trends, restraints, and opportunities. After analyzing these factors, relevant forecasting techniques i.e. Top-down was applied to arrive at the market forecast pertaining to 2025 for different segment in different region. The research methodology adopted to estimate the market size encompasses:

  • The industry’s market size and rate of adoption of packaging and assembly equipment
  • All percentage shares, splits, and breakdowns of market segments and sub-segments
  • Key players across different segments and markets as well as market share of major player. Also the growth strategies adopted by these players to compete in the rapidly growing Asia Pacific packaging and assembly equipment market

Market size and Share Validation

Primary Research: In-depth interviews were conducted with the Key Opinion Leaders (KOLs) including Top Level Executives (CXO/VPs, Sales Head, Marketing Head, Operational Head, and Regional Head etc.).  The primary research findings were summarized and statistical analysis was performed to prove the stated hypothesis. The inputs from primary research were consolidated with secondary findings, hence turning information into actionable insights.

Split of Primary Participants

Market Engineering

Data triangulation technique was employed to complete the overall market engineering process and to arrive at precise statistical numbers of each segment and sub-segment pertaining to the packaging and assembly equipment market. Data was split into several segments & sub-segments post studying several parameters and trends.

Main Objective of the Asia Pacific Semiconductor P&A equipment Market Study

The current & future market trends of the packaging and assembly equipment are pinpointed in the study. Investors can gain strategic insights to base their discretion for investments from the qualitative and quantitative analysis performed in the study. Current and future market trends would determine the overall attractiveness of the market, providing a platform for the industrial participant to exploit the untapped market to benefit as first mover advantage. Other quantitative goal of the studies includes:

  • Analyse the current and forecast market size of packaging and assembly equipment in US dollars
  • Analyse the current and forecast market size of different segments and sub-segments of packaging and assembly equipment. Segments in the study include process type and applications
  • Define and describe the processes and penetration of packaging and assembly equipment market across different sectors
  • Anticipate potential risks present within the industry
  • Customer and competitor analysis
  • Analyse the current and forecast market size of packaging and assembly equipment, for countries such as, China, Japan, India, Taiwan, Singapore, South Korea and rest of APAC
  • Define and analyse the competitive landscape of the Asia Pacific packaging and assembly equipment and the growth strategies adopted by the market players to sustain in the rapidly growing market

Research Methodology for Asia Pacific Semiconductor P&A Equipment Market

Analysing historical market, estimation of the current market and forecasting the future market for packaging and assembly equipment were the three major steps to analyse the overall adoption rate in Asia Pacific market. Exhaustive secondary research was done to collect the historical market of the industry and overall estimation of the current market. Secondly, to validate these insights, numerous findings and assumptions were taken into consideration. Moreover, exhaustive primary interviews were conducted with industry experts across the value chain of the Asia Pacific packaging and assembly equipment industry. After all the assumption, market engineering and validation of market numbers through primary interviews, top-down approach was employed to forecast the complete market size of packaging and assembly equipment market at regional scale. Thereafter, market breakdown and data triangulation methods were adopted to estimate and analyse the market size of segments and sub-segments of the market. Detailed research methodology is explained below:

Analysis of Historical Market size

Step 1: In-Depth Study of Secondary Sources:


Detailed secondary study was conducted to obtain the historical market size of the Asia Pacific packaging and assembly equipment market through company internal sources such as annual report & financial statements of top players, performance presentations, press releases, inventory records, sales figures etc. and external sources including trade journals, news & articles, government publications, economic data, competitor publications, sector reports, regulatory bodies publications, safety standard organizations, third-party database and other credible sources/publications.

Step 2: Market Segmentation:


After obtaining historical market size of the overall market, detailed secondary analysis was conducted to gather historical market insights and share for different segments & sub-segments for the packaging and assembly equipment. The major segments included in the report are process types and applications.

Step 3: Factor Analysis:


After acquiring the historical market size of different segments and sub-segments, detailed factor analysis was conducted to estimate the current market size of the packaging and assembly equipment. The factor analysis was conducted using dependent and independent variable such as purchasing power of consumers, government initiatives, and penetration of advanced electronics across several industries, among others. The historical trends of the packaging and assembly equipment and their year-on-year impact on the market size and share in the recent past were analyzed. The demand and supply side scenario was also thoroughly studied.

Current Market size Estimate & Forecast

Current Market Sizing: Based on actionable insights from the above 3 steps, we arrived at current market size, key players in market, market share of these players, industry’s supply chain, and value chain of the industry. All the required percentage shares, splits, and market breakdowns were determined using the above mentioned secondary approach and were verified through primary interviews.

Estimation & Forecasting: For market estimation and forecast, weightage was assigned to different factors including market dynamics such as drivers & trends, restraints, and opportunities. After analyzing these factors, relevant forecasting techniques i.e. Top-down was applied to arrive at the market forecast pertaining to 2025 for different segment in different region. The research methodology adopted to estimate the market size encompasses:

  • The industry’s market size and rate of adoption of packaging and assembly equipment
  • All percentage shares, splits, and breakdowns of market segments and sub-segments
  • Key players across different segments and markets as well as market share of major player. Also the growth strategies adopted by these players to compete in the rapidly growing Asia Pacific packaging and assembly equipment market

Market size and Share Validation

Primary Research: In-depth interviews were conducted with the Key Opinion Leaders (KOLs) including Top Level Executives (CXO/VPs, Sales Head, Marketing Head, Operational Head, and Regional Head etc.).  The primary research findings were summarized and statistical analysis was performed to prove the stated hypothesis. The inputs from primary research were consolidated with secondary findings, hence turning information into actionable insights.

Split of Primary Participants

Market Engineering

Data triangulation technique was employed to complete the overall market engineering process and to arrive at precise statistical numbers of each segment and sub-segment pertaining to the packaging and assembly equipment market. Data was split into several segments & sub-segments post studying several parameters and trends.

Main Objective of the Asia Pacific Semiconductor P&A equipment Market Study

The current & future market trends of the packaging and assembly equipment are pinpointed in the study. Investors can gain strategic insights to base their discretion for investments from the qualitative and quantitative analysis performed in the study. Current and future market trends would determine the overall attractiveness of the market, providing a platform for the industrial participant to exploit the untapped market to benefit as first mover advantage. Other quantitative goal of the studies includes:

  • Analyse the current and forecast market size of packaging and assembly equipment in US dollars
  • Analyse the current and forecast market size of different segments and sub-segments of packaging and assembly equipment. Segments in the study include process type and applications
  • Define and describe the processes and penetration of packaging and assembly equipment market across different sectors
  • Anticipate potential risks present within the industry
  • Customer and competitor analysis
  • Analyse the current and forecast market size of packaging and assembly equipment, for countries such as, China, Japan, India, Taiwan, Singapore, South Korea and rest of APAC
  • Define and analyse the competitive landscape of the Asia Pacific packaging and assembly equipment and the growth strategies adopted by the market players to sustain in the rapidly growing market

Asia-Pacific Semiconductor Packaging and Assembly (P&A) Equipment Market: Insights and Forecast 2018-2025