Emphasis on Process Type (Plating, Inspection and Dicing, Wire Bonding, Die-Bonding, Others (Including Packaging)), Application (Consumer Electronics, Communication, Automotive, Industrial, Other) and Country
The Asia-Pacific Semiconductor packaging and assemble equipment market is anticipated to grow at a CAGR of 5.6% during the analysed period 2019-2025. Increase use of semiconductor chip in daily used equipment’s are the major factor driving the market. Semiconductors form the foundation of all the electronics that we use in our daily lives. From alarm clock to microwave to the cell phone and laptop that enable our workday, most of the things in our surrounding are powered by semiconductor chips. The Asia Pacific is the biggest semiconductor industry across the globe and it is growing rapidly owing to the high penetration of integrated semiconductor chips across all the industry verticals. The increasing usage of semiconductor integrated chip across several industry segments like mobile and consumer electronic devices, automobiles, medical equipment, high definition television, and laptops has increased the requirement of packaging and assembly equipment. The presence of many major players in the Asian region further boosts the market. The Internet of Things and automation in automobiles have boosted the semiconductor market which in return propels the packaging and assembling equipment industry in Asian countries. The usage of semiconductor ICs for automated driving, automatic braking system, GPS, power doors and windows bring high potential in the market. However, the requirement of heavy investments, trade war and fluctuating foreign exchange rates are hampering the market. Inspite of this, the favourable government policies and increasing usage of automation in countries such as China and Taiwan are anticipated to be a key opportunity areas for the players in the industry.
APAC Semiconductor P&A Equipment Market size by Process, 2018-25 (US$ million)
“Owing to the increase in demand of advanced electronics due to growing electrification and automation of automobiles, automotive application segment is anticipated to show a remarkable CAGR during the forecast period”
The semiconductor packaging and assembly equipment market is segmented on the basis of process type and application areas. There are a number of packaging and assembly equipment processes adopted in the industry, such as plating, inspection and dicing, wire bonding, die-bonding, and others. The Die bonding held the major share in 2018. On the other hand, plating process is anticipated to be the fastest growing segment during the forecast period (2019-2025). On the basis of application, the market is bifurcated into consumer electronics, communication, automotive, industrial and others. In 2018, communications held the major share of the Asian semiconductor packaging and assembly equipment market. However, owing to the increase in demand of advanced electronics due to growing electrification and automation of automobiles, automotive application segment is anticipated to show a remarkable CAGR during the forecast period.
“The governmental funds and policies such as the National Fund and local Integrated Circuits (IC) funds, created in 2014, and the Made in China 2025 policy are some of the major reasons fuelling the demand within China”
Further, semiconductor packaging and assembly market report is bifurcated across several countries. This includes China, Japan, India, South Korea, Singapore, Taiwan and the rest of APAC. Taiwan dominated the market in 2018 and is expected to maintain its dominance while, China is expected to showcase a notable CAGR during the forecast period. The governmental funds and policies such as the National Fund and local Integrated Circuits (IC) funds, created in 2014, and the Made in China 2025 policy are some of the major reasons fuelling the demand within China.
Competitive Landscape-Top 10 Market Players
Some of the key players in the market include Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics, Jiangsu Changjiang Electronics Technology Co., Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group. These players are adopting several market strategies, such as merger & acquisition, business expansion and collaboration, among others to strengthen their foothold in the industry.
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1. Market Introduction
2. Research Methodology
3. Industry Performance
4. Executive Summary
5. Market Overview
6. Market Insights By Process Type
7. 7 Market Insights By Application
8. Market Insights By Country
9. Smart Home Market Insights, By Region
10. Top Company Profiles
Research Methodology for Asia Pacific Semiconductor P&A Equipment Market
Analysing historical market, estimation of the current market and forecasting the future market for packaging and assembly equipment were the three major steps to analyse the overall adoption rate in Asia Pacific market. Exhaustive secondary research was done to collect the historical market of the industry and overall estimation of the current market. Secondly, to validate these insights, numerous findings and assumptions were taken into consideration. Moreover, exhaustive primary interviews were conducted with industry experts across the value chain of the Asia Pacific packaging and assembly equipment industry. After all the assumption, market engineering and validation of market numbers through primary interviews, top-down approach was employed to forecast the complete market size of packaging and assembly equipment market at regional scale. Thereafter, market breakdown and data triangulation methods were adopted to estimate and analyse the market size of segments and sub-segments of the market. Detailed research methodology is explained below:
Analysis of Historical Market size
Step 1: In-Depth Study of Secondary Sources:
Detailed secondary study was conducted to obtain the historical market size of the Asia Pacific packaging and assembly equipment market through company internal sources such as annual report & financial statements of top players, performance presentations, press releases, inventory records, sales figures etc. and external sources including trade journals, news & articles, government publications, economic data, competitor publications, sector reports, regulatory bodies publications, safety standard organizations, third-party database and other credible sources/publications.
Step 2: Market Segmentation:
After obtaining historical market size of the overall market, detailed secondary analysis was conducted to gather historical market insights and share for different segments & sub-segments for the packaging and assembly equipment. The major segments included in the report are process types and applications.
Step 3: Factor Analysis:
After acquiring the historical market size of different segments and sub-segments, detailed factor analysis was conducted to estimate the current market size of the packaging and assembly equipment. The factor analysis was conducted using dependent and independent variable such as purchasing power of consumers, government initiatives, and penetration of advanced electronics across several industries, among others. The historical trends of the packaging and assembly equipment and their year-on-year impact on the market size and share in the recent past were analyzed. The demand and supply side scenario was also thoroughly studied.
Current Market size Estimate & Forecast
Current Market Sizing: Based on actionable insights from the above 3 steps, we arrived at current market size, key players in market, market share of these players, industry’s supply chain, and value chain of the industry. All the required percentage shares, splits, and market breakdowns were determined using the above mentioned secondary approach and were verified through primary interviews.
Estimation & Forecasting: For market estimation and forecast, weightage was assigned to different factors including market dynamics such as drivers & trends, restraints, and opportunities. After analyzing these factors, relevant forecasting techniques i.e. Top-down was applied to arrive at the market forecast pertaining to 2025 for different segment in different region. The research methodology adopted to estimate the market size encompasses:
Market size and Share Validation
Primary Research: In-depth interviews were conducted with the Key Opinion Leaders (KOLs) including Top Level Executives (CXO/VPs, Sales Head, Marketing Head, Operational Head, and Regional Head etc.). The primary research findings were summarized and statistical analysis was performed to prove the stated hypothesis. The inputs from primary research were consolidated with secondary findings, hence turning information into actionable insights.
Split of Primary Participants
Market Engineering
Data triangulation technique was employed to complete the overall market engineering process and to arrive at precise statistical numbers of each segment and sub-segment pertaining to the packaging and assembly equipment market. Data was split into several segments & sub-segments post studying several parameters and trends.
Main Objective of the Asia Pacific Semiconductor P&A equipment Market Study
The current & future market trends of the packaging and assembly equipment are pinpointed in the study. Investors can gain strategic insights to base their discretion for investments from the qualitative and quantitative analysis performed in the study. Current and future market trends would determine the overall attractiveness of the market, providing a platform for the industrial participant to exploit the untapped market to benefit as first mover advantage. Other quantitative goal of the studies includes:
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October 25, 2024
